Photonics Product Roadmap

Maturing our Perkinamine® platform

We are enabling polymer devices to extend silicon photonics using our EO polymers…

Over the last 5 years, the company has evolved from initial focus on innovative materials only to leveraging those materials in modulator devices.

Product Roadmap

Lightwave Logic is developing a flexible technology platform that can support a variety of product configurations.  The central element of the platform is a high-speed (50 Gbps and above) modulator device that can be integrated in multiple ways depending on the target application. The current platform also supports lower speed devices with only minor design differences.

Shown below are some of the wide range of potential modulator products based on the same nominally 50 Gbps (more accurately 50 Gbaud) device. 100 Gbps and 400 Gbps are highlighted as popular datacom applications. The total aggregate bitrate capacity shown below ranges from 50 Gbps to 800 Gbps depending on:

  • The number of devices integrated into a single chip
  • The way the device is used. PAM-4 modulation is an industry-standard approach that doubles the effective bitrate of a given device. Even more complex modulation schemes can increase the effective bitrate even more.

100 Gbps and 400 Gbps are  popular datacom applications highlighted in the diagram below.

The current platform also supports lower speed devices with only minor design differences. The company is working on extending the platform to even higher speeds. The same integration options would apply. For example, with 100 Gbaud devices, all the capacities in the above diagram would be doubled.

Near Term Commercial Activities & Goals

Development Plan

Development Plan Beyond 50/100 Gbaud

The plan for extending the platform further was presented in May 2020 at the Annual Shareholder Meeting.

Development Plan Beyond 50/100 Gbaud

With speeds comfortably in the 50/100 Gbaud range, the development scope is expanding to integration into arrays and with other elements.

The plan continues to drive fundamental advances in materials with additional performance advantages.